---
title: SenSys
full_name: ACM/IEEE International Conference on Embedded Artificial Intelligence and
  Sensing Systems
domain:
- embedded-systems
- sensor-networks
- embedded-ai
- iot
type: conference
icore_rank: A*
homepage: https://sensys.acm.org/2027/
dblp_key: conf/sensys
draft: false
next_deadline: Jun 5, 2026
abstract_deadline: May 29, 2026
notification: Aug 31, 2026
location: New York, NY, USA
cfp_url: https://sensys.acm.org/2027/cfp.html
---

*ACM/IEEE International Conference on Embedded Artificial Intelligence and Sensing Systems*

| | |
|---|---|
| **ICORE Rank** | **A\*** |
| **Domains** | `embedded-systems`, `sensor-networks`, `embedded-ai`, `iot` |
| **Website** | [https://sensys.acm.org/2027/](https://sensys.acm.org/2027/) |

## Upcoming Deadline

| | |
|---|---|
| **Abstract deadline** | May 29, 2026 |
| **Paper deadline** | Jun 5, 2026 |
| **Notification** | Aug 31, 2026 |
| **Event dates** | — |
| **Location** | New York, NY, USA |
| **CFP** | [https://sensys.acm.org/2027/cfp.html](https://sensys.acm.org/2027/cfp.html) |